Advanced Materials
for Electronics

We are Transene Company Inc., founded in 1965 by Dr. Benjamin P. Hecht. Foremost in research and development of new materials for electronics and aerospace. Fields of interest encompass dielectrics, capacitors, photoresist materials, adhesives, electrophoretic cathode coatings, conformal coatings, chemical etchants, electrolytic and electroless plating chemistries, encapsulants, and high purity cleaning compounds.

Our products find extensive use in semiconductor microelectronics, thin film and thick film hybrid microelectronic circuits, electronic components, photonics, LED, TFT, and other electronic applications.
Transene Company is ISO9001:2000 Certified . . . . Transene Materials are RoHS Compliant . . . . Visit Our New Products Section for the Latest in Transene Materials

Etchant, Electronic Chemicals and High Purity Chemicals by Transene Company

Advanced Materials for Electronics

We are Transene Company Inc., founded in 1965 by Dr. Benjamin P. Hecht. Foremost in research and development of new materials for electronics and aerospace. Fields of interest encompass dielectrics, capacitors, photoresist materials, adhesives, electrophoretic cathode coatings, conformal coatings, chemical etchants, electrolytic and electroless plating chemistries, encapsulants, and high purity cleaning compounds.
Our products find extensive use in semiconductor microelectronics, thin film and thick film hybrid microelectronic circuits, electronic components, photonics, LED, TFT, and other electronic applications.
Transene Company manufactures high purity materials including chemical etchant, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver


We are Transene CO INC, founded in 1965 by Dr. Benjamin P. Hecht. Foremost in research and development of new materials for electronics and aerospace. Fields of interest encompass dielectrics, capacitors, photoresist materials, adhesives, electrophoretic cathode coatings, conformal coatings, chemical etchants, electrolytic and electroless plating chemistries, encapsulants, and high purity cleaning compounds.
Our products find extensive use in semiconductor microelectronics, thin film and thick film hybrid microelectronic circuits, electronic components, photonics, LED, TFT, and other electronic applications.
TRANSENE COMPANY, INC. is competent and ready to help resolve technical problems and to engage in the development of special materials for our customers. Please feel free to consult with us regarding your special materials problems.

Transene Company manufactures high purity materials including chemical etchants, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver


CUSTOM SERVICES

Transene offers complete custom and toll services in addition to our standard products. We are happy to work with your engineers and scientists to provide timely, cost-effective solutions to your company's needs. Whether the quantity is one gallon or hundreds of gallons, Transene stands ready to manufacture according to your formulation or to customize one of our standard products to meet your unique application. Our technical staff will work with you to set up a procedure, devise quality control specifications, and prepare appropriate documentation and certification for the finished product. All custom products are treated with complete confidentiality. Please tell us how we can help you. Transene's Class 100 cleanroom packaging facility enables us to serve the exacting needs of the semiconductor industry. Combined with 0.2 micron filtration and ultrapure ingredients, our cleanroom allows us to ensure particulate-free products. Sizes from quart to drum are available. Transene is able to certify RoHS compliance and TSCA listing for our products.

Transene Company manufactures high purity materials including chemical etchants, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver transene070904

General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xylene polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy. Resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.

Applications
General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.


Transene Company manufactures high purity materials including chemical etchants, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver

Thin Film Etchants

DESCRIPTION:
Thin Film Etchants are used to obtain selective etching of gold, nickel, chromium and nichrome films in the photo fabrication of microelectronic circuits. These etchants, used in conjunction with photoresist technology, form precise electrodes and resistor patterns in thin films prepared on alumina substrates. Thin Film Etchants are room temperature operable solutions. These etchants are compatible with both negative and positive photoresist materials and permit excellent fine line definition.

Thin Film Etch Process

Thin films are prepared on alumina substrate by evaporation or sputtering processes. The film thickness is held uniform for close control of circuit parameters.


Transene Company manufactures high purity materials including chemical etchants, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver

Insul-Bond Epoxy Adhesives
ONE-PART LOW TEMPERATURE CURING SYSTEMS
Insul-bond Adhesives are solvent-free, low gassing epoxy formulations recommended for discrete component attachment, substrate mounting and lid sealing in the production of high reliability hybrid microcircuits. These adhesives provide multiple bonding of chips or components in a single operation while maintaining low processing temperatures. Subsequent thermal compression or ultrasonic bonding operations are feasible.
Insul-Bond Epoxy 13, 14 and 15 maintain minimal outgassing, high electrical resistivity and high bond strength to 200 °C operating temperatures. Compatibility with aluminum and other metallizations common to microelectronic devices is assured.


Transene Company manufactures high purity materials including chemical etchants, encapsulants, conductive and insulative adhesives, semiconductor dopants and materials, and electroplating chemicals for semiconductor and electronics packaging. Specializing in etchant etch microelectronic etchant semiconductor etchant metal etchant chemical etchant wet etchant electronic chemical high purity chemical epoxy adhesive conductive epoxy wax stripper wax remover semiconductor mounting wax stripper plating silicone die attach surface mount electronic packaging mixed acid etch semiconductor cleaning MEMS etch gold etch nickel etch chromium etch nichrome etch aluminum etch copper etch silicon etch gallium arsenide etch oxide etch titanium etch tantalum etch silicon nitride etch alumina etch dopant thermal conductive epoxy thermal conductive silicone silver epoxy potting compound encapsulant electroless nickel electroless gold nickel plating gold plating junction coating resistor coating nanotube adhesive silver plating copper plating electroless copper electroless silver


Bright Electroless Tin
Simple immersion technique for bright electroless tin plating process. Deposit pure tin onto copper, brass, other copper-based alloys, gold and lead-tin electroplate.

DESCRIPTION:
Bright Electroless Tin is a well-developed formulation based upon the reduction characteristics of chelated tin in the divalent state. Under proper conditions reduction to pure tin occurs readily. A grain-refining agent, free of phosphorus, is present as well as an activator and buffers for pH control. The deposited tin, in addition to good chemical resistance, exhibits excellent adhesion and is very solderable even after exposure to extreme humidity testing. Bright Electroless Tin is therefore used to provide corrosion protection to copper and lead-tin electroplate. A minimum of 25 millionths of an inch of tin deposit is required. Bright Electroless Tin is recommended to preserve solderability of printed circuit boards, either copper or lead-tin electroplate. It is also used for plating electronic parts such as diodes or leads and for the corrosion protection of die stampings and machined copper or brass parts.