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Ti-Tungsten TiW-30 Ti-Tungsten TiW-30 is a selective etchant for titanium-tungsten adhesion layers in microelectronics applications. TiW-30 effectively etches Ti-tungsten films deposited on silicon nitride, or silicon oxide. TiW-30 provides excellent definition and etch rate control. Broad compatibility with positive and negative photoresists is offered. APPLICATION: Ti-Tungsten TiW-30 etchant is a ready-to-use solution specifically designed to remove titanium-tungsten alloy adhesion layers from substrates such as silicon dioxide and silicon nitride. TiW-30 will not attack aluminum films. Heating the etchant to 40°C will speed the etch rate for thicker films. PROPERTIES:
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