Transene - Etchants-Tantalum Etchants

TANTALUM ETCHANTS SIE-8607 and 111

DESCRIPTION:

Transene Tantalum Etchants SIE-8607 and 111 are high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications. Tantalum Etchant SIE-8607 is a more aggressive etchant for faster etch rates. Tantalum Etchant 111 is a slower etching solution for optimum control and is more effective for removing tantalum oxide layers. Both etchants are filtered to remove all particulates above 0.2 microns.

PROPERTIES:

	Tantalum Etch SIE-8607	Tantalum Etch 111
Appearance	Clear	Clear
Solubility	Infinite in water	Infinite in water
Filtration	0.2 microns	0.2 microns
Operating Temperature	25 °C	25 °C
Etch Rate (Ta), 25 °C	70-80 Å / sec	30-40 Å / sec
Storage	Room Temperature	Room Temperature
Shelf Life	1 year	1 year
Mask Materials	Gold; Positive or Negative Photoresists	Gold; Positive or Negative Photoresists
Rinse	Deionized Water	Deionized water

APPLICATION:

Etch times vary depending on material type (Ta, TaN, or Ta₂O₅) and purity. Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation. Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.