TANTALUM ETCHANTS SIE-8607 and 111

DESCRIPTION:

Transene Tantalum Etchants SIE-8607 and 111 are high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications. Tantalum Etchant SIE-8607 is a more aggressive etchant for faster etch rates. Tantalum Etchant 111 is a slower etching solution for optimum control and is more effective for removing tantalum oxide layers. Both etchants are filtered to remove all particulates above 0.2 microns.

PROPERTIES:

 

Tantalum Etch SIE-8607

Tantalum Etch 111

Appearance

Clear

Clear

Solubility

Infinite in water

Infinite in water

Filtration

0.2 microns

0.2 microns

Operating Temperature

25 °C

25 °C

Etch Rate (Ta), 25 °C

70-80 Å / sec

30-40 Å / sec

Storage

Room Temperature

Room Temperature

Shelf Life

1 year

1 year

Mask Materials

Gold; Positive or Negative Photoresists

Gold; Positive or Negative Photoresists

Rinse

Deionized Water

Deionized water


APPLICATION:

Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity. Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation. Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.