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Tin 100%Plating Solution

The tin plating solution consists of metal fluoborates, addition agents, stabilization additives and proprietary wetting agents in ready-to-use form. The solution affords a high degree of uniformity and fine grain structure with a minimum of operational control. Excellent solderability and wire plating.

OPERATING CONDITIONS –For all Plating Solutions

Bath pH

 < .5

Temperature (°F)

 70-100

Current Density (Amp./Sq.Ft.)

 25-30

Voltage (volts)

 2-4

Anodes (Polyprop. Bagged)

 Same as metal plating compositions

Anode Efficiency (%)

 100

Anode to Cathode Ratio

 2:1

Agitation (Cathode-Rod)

 Mild

Filtration:

(Continuous or periodic)

 Rubber-lined steel filter presses or Other acid-resistant equipment. Filter Materials can be Terylene, nylon cloth filter paper or paper pulp.


PLATING CONTROL

  1. All materials which contact plating solution must be lined with PVC, Koroseal, rubber, Lucite, or polypropylene.
  2. Operating temperatures above 100 °F will increase % tin deposited.
  3. Cathode current density less than 25 asf will decrease % tin in alloy deposit. Conversely, current density greater than 30 asf will increase % tin in alloy deposit.
  4. Air agitation must not be used as it will oxidize tin. Adequate agitation may be provided by a moving work rod.
  5. A plating thickness of .001" will be deposited in 17-20 minutes @ current density of 25-30 asf.