Tin–Lead Plating Solutions

Tin, lead and tin – lead alloy plating solutions for corrosion protection provide fine grain structure and minimum operational control.

LEAD – 100%
Maximum corrosion resistance

TIN-LEAD ALLOY 5-95
Recommended for bearings

TIN-LEAD ALLOY 10-90
Special lubrication properties

TIN-LEAD ALLOY 60-40
Standard plating composition

TIN-LEAD ALLOY 80-20
Excellent solderability

TIN-100%
For wire plating applications

TIN-LEAD PLATING SOLUTIONS
DESCRIPTION

The tin-lead plating solutions consist of metal fluoborates, addition agents, stabilization additives and proprietary wetting agents. The plating solutions are available in ready-to-use form. Various alloy compositions of tin-lead offer a high degree of uniformity and fine grain structure and require a minimum of operational control. Alloy compositions high in tin provide excellent solderability. High lead alloy compositions are recommended for extreme corrosion resistance and lubricating properties as required for bearings. Pure lead is employed for extreme corrosion resistance while pure tin is recommended for plating wires for solderability.

COMPOSITION (oz./gal. metal)

100% Lead

11.0

Tin-Lead Alloy 60-40

9.0 Sn/ 5.4 Pb

Tin-Lead Alloy 5-95

.8 Sn/12.6 Pb.

Tin-Lead Alloy 80-20

10.0 Sn/2.7 Pb.

Tin-Lead Alloy 10-90

1.34 Sn/12.1 Pb.

100% Tin

11.0


OPERATING CONDITIONS –For all Plating Solutions

Bath pH

 < .5

Temperature (°F)

 70-100

Current Density (Amp./Sq.Ft.)

 25-30

Voltage (volts)

 2-4

Anodes (Polyprop. Bagged)

 Same as metal plating compositions

Anode Efficiency (%)

 100

Anode to Cathode Ratio

 2:1

Agitation (Cathode-Rod)

 Mild

Filtration:

(Continuous or periodic)

 Rubber-lined steel filter presses or Other acid-resistant equipment. Filter Materials can be Terylene, nylon cloth filter paper or paper pulp.


PLATING CONTROL

  1. All materials which contact plating solution must be lined with PVC, Koroseal, rubber, Lucite, or polypropylene.
  2. Operating temperatures above 100 °F will increase % tin deposited.
  3. Cathode current density less than 25 asf will decrease % tin in alloy deposit. Conversely, current density greater than 30 asf will increase % tin in alloy deposit.
  4. Air agitation must not be used as it will oxidize tin. Adequate agitation may be provided by a moving work rod.
  5. A plating thickness of .001" will be deposited in 17-20 minutes @ current density of 25-30 asf.