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SILVER-MET Silver Metallizations for Non-Metals Silver-filled, air-drying polymer formulations designed to provide high conductivity metallizations on plastics, paper, mica, ceramic and other non-conductive materials. SILVER-MET 145
SPECIAL APPLICATIONS:
DESCRIPTION Transene Silver-Met formulations are silver-filled, air-drying polymers designed to provide high conductivity metallizations on plastics, paper, mica, and other non-conductive surfaces. The silver film allows direct soft-soldering without the use of flux. The film also permits subsequent metallizations through the electroplating process. Silver-Met is suggested for use in electronics and microwave applications for connectors, contacts, magnetic shielding, capacitor terminations, etc. The product is most effective for RF /EMI shielding because it reflects as well as absorbs energy. For tantalum capacitors, Silver-Met functions uniquely as terminations for the capacitor. Properties of Silver-Met
APPLICATION SILVER-MET 145 and SILVER-MET 170 may be applied by brush, dip or spray techniques. After application, substances should be allowed to level and air-dry at room temperature for 1/2 hour to 1 hour, then baked at 80° to 100° C for 1 hour to obtain complete drying. SILVER-MET 270 may be applied by screen printing using standard 180 to 200 mesh screen. After application substrates should be allowed to level for 5 to 10 minutes, then baked at 80° to 125° C for 1 hour to obtain complete drying. SILVER-MET 170 and 270 provide a metallic base for direct soft-soldering at temperatures up to 190° C. Types 145, 170, and 270 provide a suitable base for further metallization by electroplating. |
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