SILVER-MET
Silver Metallizations for Non-Metals

Silver-filled, air-drying polymer formulations designed to provide high conductivity metallizations on plastics, paper, mica, ceramic and other non-conductive materials.

SILVER-MET 145

  • Brush, dip or spray application
SILVER-MET 170

  • Brush, dip or spray application
  • High silver density
SILVER-MET 270

  • Screen print application

SPECIAL APPLICATIONS:

  • Tantalum capacitor terminations
  • Shielding against RF/ EMI
SILVER-MET

DESCRIPTION

Transene Silver-Met formulations are silver-filled, air-drying polymers designed to provide high conductivity metallizations on plastics, paper, mica, and other non-conductive surfaces. The silver film allows direct soft-soldering without the use of flux. The film also permits subsequent metallizations through the electroplating process.

Silver-Met is suggested for use in electronics and microwave applications for connectors, contacts, magnetic shielding, capacitor terminations, etc.

The product is most effective for RF /EMI shielding because it reflects as well as absorbs energy. For tantalum capacitors, Silver-Met functions uniquely as terminations for the capacitor.

Properties of Silver-Met

 

Type 145

Type 170

Type 270

Application

Dip/ Spray

Dip/ Brush

Screen print

Silver Content

45%

70%

70%

Viscosity (cps)

500

45,000

150,000

Thinner

Butyl Acetate

Butyl Acetate

Butyl Carbitol Acetate

Sheet Resistance

(milli-ohms/sq/mil)

160

160

160

Service Temperature

- 30° to 110° C

- 30° to 110° C

- 30° to 110° C

Drying Time @ 25° C

20 hours

20 hours

N/A

Drying Time @ 80° - 125° C

1 hour

1 hour

1 hour

APPLICATION

SILVER-MET 145 and SILVER-MET 170 may be applied by brush, dip or spray techniques. After application, substances should be allowed to level and air-dry at room temperature for 1/2 hour to 1 hour, then baked at 80° to 100° C for 1 hour to obtain complete drying.

SILVER-MET 270 may be applied by screen printing using standard 180 to 200 mesh screen. After application substrates should be allowed to level for 5 to 10 minutes, then baked at 80° to 125° C for 1 hour to obtain complete drying.

SILVER-MET 170 and 270 provide a metallic base for direct soft-soldering at temperatures up to 190° C. Types 145, 170, and 270 provide a suitable base for further metallization by electroplating.