Epoxy silver compositions for conductive bonding in microelectronic assembly applications
SILVER-BOND - TYPE 40
Standard low-temperature cure, high electrical conductivity
SILVER-BOND - Type 50
Fast low-temperature cure, high electrical conductivity
SILVER-BOND - TYPE 60
Long pot life, fast cure
FEATURES
Low temperature curing systems
High bond strength
Electrical resistivity < 10-4ohm-cm
Low outgassing
Long pot life
Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz
SILVER-BOND
Conductive Adhesive
Description
Silver-Bond is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts. It provides high bond strength and excellent conductivity as well as low-temperature cure and long pot life. The product is designed for conductive bonding applications in microelectronics in place of lead tin solder or other alloys to avoid flux contamination or exposure to excessive temperature, and for process simplification. Silver-Bond Type 40 is especially recommended for bonding applications where it is desirable to keep process temperatures in the 100 °C range. Silver-Bond Type 50 is modified for faster curing applications. Silver-Bond Type 60 provides extended pot-life with fast cure at slightly elevated temperatures.