Silver Bond
Low Temperature Thermosetting Silver

Epoxy silver compositions for conductive bonding in microelectronic assembly applications

SILVER-BOND - TYPE 40
Standard low-temperature cure, high electrical conductivity

SILVER-BOND - Type 50
Fast low-temperature cure, high electrical conductivity

SILVER-BOND - TYPE 60
Long pot life, fast cure

FEATURES
  • Low temperature curing systems
  • High bond strength
  • Electrical resistivity < 10-4ohm-cm
  • Low outgassing
  • Long pot life
  • Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz
SILVER-BOND
Conductive Adhesive
Description

Silver-Bond is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts. It provides high bond strength and excellent conductivity as well as low-temperature cure and long pot life. The product is designed for conductive bonding applications in microelectronics in place of lead tin solder or other alloys to avoid flux contamination or exposure to excessive temperature, and for process simplification. Silver-Bond Type 40 is especially recommended for bonding applications where it is desirable to keep process temperatures in the 100 °C range. Silver-Bond Type 50 is modified for faster curing applications. Silver-Bond Type 60 provides extended pot-life with fast cure at slightly elevated temperatures.

PROPERTIES OF SILVER-BOND

 

Type 40

Type 50

Type 60

Composition

Silver Filled Epoxy

same

same

Consistency

Soft Thixotropic paste

same

same

Viscosity

90,000 cps ± 10%

same

same

Elect. resitivity

1 x 10-4 ohm-cm max.

same

same

Lap shear strength

1500 psi nominal

same

same

Temperature stability range

-65 °C to + 200 °C

-65 °C to + 175 °C

-65 °C to + 175 °C

Outgassing (postcure)

<.01%/100 hr. @ 125 °C

same

same

Thermal conductivity

80 BTU-in/ft2hr°F

same

same

Pot life

6 hrs at 25 °C

2 hrs @ 25 °C

48 hrs @ 25 °C

Shelf life

one year @ 25 °C

same

same

Mixing ratio A:B(by wt.)

100/3.6

100/2.5

100/2.5

Cure (at 100 °C)

2 hrs

10 minutes

10 minutes

Thinner

Butyl Cellosolve Acetate

same

same

Mixing ratio (A : B)

100/3.6

100/2.5

100/2.5

Part A

Part B

Part B

Part B

1 gram

0.036 gm (1 drop)

0.024 gm (1 drop)

1 drop

5 grams

0.180 gm (6 drops)

0.124 gm (4 drops)

4 drops

1 oz. (28.35gm)

1.023 gms (34 drops)

0.76gm (24 drops)

24 drops

Cure schedule
(Time: Temperature Relationship)

50 °C

----

30 minutes

----

75 °C

2 1/2 hrs.

15 minutes

----

100 °C

2 hrs.

10 minutes

10 minutes

125 °C

1 1/2 hrs.

5 minutes

5 minutes

150 °C

1 hr.

----

2 minutes