Transene - Encapsulants

Silicone Semi-Gel
Transparent Dielectric Potting

Transparent silicone potting systems – cures to a soft elastomer gel material – for mechanical cushioning, vibration damping and protective coating of sensitive microelectronic devices and circuits.

SILICONE SEMI-GEL TYPE C
Two-part, quick cure, self healing

FEATURES:

Low viscosity – quick cure
Shock-absorbing
Service temperature range –60 °C to + 200 °C

SILICONE SEMI-GEL
DESCRIPTION

Translastic Semi-Gels are one part silicone products which cure to a mechanical energy absorbing material. The physical properties of the cured product are intermediate between true gel and elastomeric products, offering unique advantages for the protection of sensitive electronic devices and microelectronic circuits. It is used for environmental protection and to guard against effects of shock and vibration.

Semi-Gels have a low viscosity in the uncured state which flows readily around delicate assembly structures. The product is applied easily for potting, encapsulation, embedding, coating and casting where shock absorbing material is required from –60 °C to + 200 °C. Two types of Semi-Gel are offered: B + C

Properties of Silicone Semi-Gels B + C

Uncured	Semi-Gel Type B	Semi-Gel Type C
System	One-Part	Two-part
Viscosity, cps	3,000	750
Solids	100%	100%
Shelf Life	3 months	12 months
Storage	40 °F or lower	Room Temp.
Pot Life	------	2 hours
Cured
Color	Optically clear	Optically clear
Sp.Gr.	1.02	.95
Hardness (Shore A)	15	-----
Penetration	-----	-----
Tensile Strength (psi)	250 min	-----
Elongation	100%	-----
Dielectric Constant	3.0	2.5
Dissipation Factor	.0008	.0001
Dielectric Strength	> 500	500
Volume Resistivity (ohm-cm)	8 x 10¹⁵	10¹⁵
Serv. Temp Range	-60 °C to +200 °C	-60 °C to +200 °C
Cure
Mixing Ratio (by wt.)	Not applicable	1 part A: 1 part B
Cure Schedule	3 hrs @ 100 °C or	16 hrs @ 25 °C or
	2 ½ hrs @ 125 °C or	½ hr. @ 100 °C or
	1 hour @ 150 °C	10 min @ 135 °C *Vacuum deaerating recommended after mixing.
Coefficient of Thermal Expansion	15 x 10^-5 in/in °F (0-350 °F)

APPLICATIONS:

Semi-Gel is recommended as a dielectric cushioning material for integrated circuits to protect fine wire interconnections. It functions as a mechanical shock absorber and for vibration damping to ensure high reliability. Similarly the product is used for thick-film hybrid and thin-film microelectronic circuits as well as for other sensitive equipment.