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Translastic ® S-2007
Silicone Junction Coating For Rectifiers

Dielectric coating or encapsulating material for electrical components, electronic units and semiconductor rectifiers.

FEATURES
  • Uniform and heat-stable
  • Waterproof
  • Resistant to oxidation and weathering
  • Rapid heat dissipation
  • Easy to apply
  • Superior flow characteristics
  • Fast cure
  • No preliminary vulcanization
TRANSLASTIC ® S-2007
DESCRIPTION

Translastic S-2007 is an excellent dielectric coating or encapsulating material for electrical components, electronic units and semiconductor rectifiers.

Translastic S-2007 cures to form a resilient jacket which is uniform, heat-stable, waterproof and highly resistant to oxidation, ozone and weathering. Its high thermal conductivity permits rapid dissipation of heat. The excellent dielectric properties and resistance to moisture assure reliable operation under the most adverse humidity conditions.

Supplied as a solvent free, low consistency, silicone rubber composition, Translastic S-2007 is suitable for dipping or vacuum impregnation. It is virtually as easy to apply to intricately shaped parts as to simple shapes. Its flow characteristics enable it to uniformly cover all contours. It is fast curing and does not require preliminary vulcanization.

PROPERTIES OF TRANSLASTIC S-2007

Uncured

  

Color

White

Specific Gravity

1.3

Viscosity (cps.nominal)

200,000

Cure Temperature

150 °C (minimum)

Shelf Life @ 25 °C

3 months

@ 10 °C

6 months

Cured

  

Durometer (Shore A)

45

Tensile Strength psi

450

Elongation %

150

Dielectric Strength, volts per mil

500

Dielectric Constant at 102 cycles

3.52

Dielectric Constant at 106 cycles

3.48

Power Factor at 102 cycles

0.0035

Power Factor at 106 cycles

0.0015

Volume Resistivity, ohm cm

17.2 x 1013

After 7 days at 100% rel. humidity

8.6 1013

Surface Resistivity, ohms

2.82 x 1013

After 7 days at 100% rel. humidity

0.5 x 1013

Viscosity can be modified to suit custom applications

  


APPLICATION

Translastic S-2007 may be applied under pressure through a hypodermic needle. However, the geometry and size of the component part may determine the most suitable technique for the application of the material, such as transfer, dipping or by vacuum impregnating.

The temperature and time for curing the material can be varied. Curing is done in an air oven. It is preferable to cure at a lower temperature first, about 90 °C for ½ hour, followed by a higher temperature cure, up to 200 °C or higher. The final temperature for the cure should be 200 °C for at least 4 hours.