 |
|
 |
 RUTHENIUM ETCHANT RU-44
Transene Ruthenium Etchant RU-44 is a ceric ammonium nitrate / nitric acid etching solution for all types of evaporated ruthenium films. Etch rate will depend upon substrate ruthenium density and process conditions. In general, the etch time usually ranges from 15 to 55 seconds at room temperature (25°C). The etchant can be supplied with an added surfactant (Ruthenium Etchant RU-44S ). Ruthenium Etchant RU-44 is suitable for sub-micron photolithography applications. For faster etch results, Transene Chromium Cermet Etchant TFE may be used.
Storage and Handling:
Store at room temperature away from direct sunlight, keep container sealed when not in use. This is an acid oxidizing solution and should be handled with caution. In case contact is made to eyes or skin, flush with large quantities of water and contact a physician if irritation persists.
Physical and Chemical Properties:
| Appearance |
Clear, orange liquid |
| pH (20°C) |
less than 1.0 |
| Specific Gravity (20°C) |
1.103-1.105 |
| Filtration |
0.2 micron |
| Metals |
meets or exceeds SEMI specifications |
| Etch Rate |
40-50 angstroms/second |
| Operating Temperature |
20-25 °C |
| Tank |
Glass or polypropylene |
|
 |
 |
 |