 |
|||||||||||
|
 |
 POSITIVE RESIST REMOVERS PRR-001 and PRR-002 PRR-001 DESCRIPTION: Positive Resist Remover PRR-001 is composed of a proprietary mixture of water miscible and biodegradable ingredients. PRR-001 is formulated to remove (dissolve) all the common positive working photoresists baked onto various substrates (ex: gallium aresenide, silicon, chrome) and is non-corrosive to various metal and oxide surfaces under proper usage. PRR-001 Remover does not contain phosphates, chromates, phenol, chlorinated hydrocarbons, nor sulfonic acids, and no special handling precautions are necessary. PRR-001 works well at room temperature with a bath life of approximately 2000 wafers/gallon. At elevated temperatures removal of polyamide can be achieved. The cost per wafer is less than one penny. The shelf-life of PRR-001 is one year when stored in a cool area away from direct sunlight. CHEMICAL AND PHYSICAL PROPERTIES:
APPLICATION: Bath Make-Up: Full strength for all semiconductor operations, by a spray or immersion process. Bath Operations: For immersion work, 3 to 5 minutes at room temperature with agitation. Solution can be at elevated temperatures (70-90°C). Use of two tank systems for immersion removal or conveyorized equipment for spray removal. Rinse: PRR-001 is completely miscible with water: only D.I. water rinse is necessary. Bath Life: Bath replacement should take place when removal time exceeds 15 minutes or when quantity stripped exceeds 2000 wafers/gallon. PRR-002 DESCRIPTION: Positive Resist Remover PRR-002 is composed of a proprietary mixture of water miscible and biodegradable ingredients. It is specially formulated to remove (dissolve) all common positive working photoresists treated with deep UV for ion implant, ion milling or plasma etch systems on various metal substrates. PRR-002 is non-corrosive to various metal and oxide surfaces under proper usage. PRR-002 Remover does not contain phosphates, chromates, phenol, chlorinated hydrocarbons, nor sulfonic acids, and no special handling precautions are necessary. PRR-002 is compatible with all teflon, polypropylene and polyethylene materials. PRR-002 works well at room temperature or at slightly elevated temperatures for difficult stripping situations. Use of PRR-002 will result in noticeable cost saving per wafer. PRR-002 should be stored in a cool area away from direct sunlight. The recommended shelf-life is six months. CHEMICAL AND PHYSICAL PROPERTIES:
APPLICATION: Bath Make-Up: Full strength for most semiconductor operations. Bath Operations: A two-tank system is recommended.
2. For deep UV and hardened resist processing (150°- 200°C): 55° to 90° for 5-10 minutes per tank. Rinse: PRR-002 is completely miscible with water; only D.I. water rinse (5 min.) is necessary. Bath Replenishment / Replacement: Bath replacement should take place when removal time exceeds 15 minutes or when quantity stripped exceeds 2000 wafers/gallon.
2. Bath replacement should be done when removal time exceeds 20 minutes per tank. |
|||||||||
 |
|||||||||||
 |
 |
||||||||||
