Palladium Etchants

PALLADIUM ETCHANT TFP

Palladium Etchant TFP is designed for high resolution pattern delineation of sputtered, evaporated and electrolessly deposited films. These films are commonly employed barrier layers for silicon wafer metalization systems of nickel and gold.

PROPERTIES:

Appearance

Dark Amber Aq. Sol.

pH

< 1

Flash Point

Non-Flammable

Storage

Room-Temperature

Shelf/Life

1 year

Toxicity

Acid

OPERATION:

Tank

Glass/Pyrex/PVC

Temperature

40-60 °C

Etch Rate

110Å/Sec @ 50°C

Rinse

Water

Compatible Resists

Pos. & Neg.

Metallization

Gold/Ni-gold


PALLADIUM ETCHANT EC

Palladium Etchant EC is formulated for precise electrochemical etching of palladium substrates. Electrochemical etching allows for targeted etching of the substrate material.

OPERATION:

Appearance

Transparent Solution

pH

< 1

Temperature

25-30 °C

Power

10 V DC

Cathode

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