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Palladium Etchants PALLADIUM ETCHANT TFP Palladium Etchant TFP is designed for high resolution pattern delineation of sputtered, evaporated and electrolessly deposited films. These films are commonly employed barrier layers for silicon wafer metalization systems of nickel and gold. PROPERTIES:
OPERATION:
PALLADIUM ETCHANT EC Palladium Etchant EC is formulated for precise electrochemical etching of palladium substrates. Electrochemical etching allows for targeted etching of the substrate material. OPERATION:
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