NICKEL VANADIUM ETCHANT NiV 28-23

DESCRIPTION:

Transene Thin Film Nickel Vanadium Etchant NiV 28-23 is a high-purity nitrate-based formulation for superior etching of evaporated nickel-vanadium alloy. NiV 28-23 is compatible with both positive and negative photoresist materials. Recommended resists include AZ-111, AZ-1350 OH, and KMER. NiV 28-23 etchant meets SEMI grade standards and is filtered to 0.2 micron.

PROPERTIES:

Etchant Type

Nickel Vanadium NiV 28-23

Operating Temperature

25 °C

Etch Rate
(varies with ratio)

25-35 Å/sec

Alloy Deposition

Evaporated / sputtered

Etch Capacity

220 grams / gal

Typical Film Thickness

1500 Å/ 5-50 micro inches

Tank

Glass


APPLICATION:

Nickel Vanadium Etchant NiV 28-23 is supplied ready-to-use as an immersion type etchant. Etch rates may be controlled via operating temperature. Actual etch is related to film thickness, alloy makeup, density, and operating temperature but is typically approximately one minute for evaporative deposits. Etching should be followed with a deionized water rinse.