Electroless Nickel Plating Strike
For Copper, Brass and Copper Alloys

An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloys.

PROPERTIES:

Appearance

Green solution

Operating Temp.

85 °C – 95 °C

pH

3.2 optimum

Plating Rate

20 x 10-6 in./min.

Deposition

Nickel 90%/Phosphorus 10%

Plating Capacity
( 50% depletion)

6,750 sq. in. / 20 m in./gal.


CLEANING PROCEDURE FOR COPPER SAMPLES:
  1. Clean copper with some physical abrasion.
  2. Dip for one minute in alkaline cleaner at 65 °C (150 °F).
  3. Rinse with deionized water.
  4. Dip for one minute in 30% HCl
  5. Rinse with deionized water.
PLATING BATH – USE AND CONTROL

Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (Electroless Nickel Plating). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.