Etchants for evaporated or electroplated nickel films. Good compatibility with positive and negative photoresists. Ideal for gold / nickel / nichrome or chromium resistor boards with alumina substrates.
NICKEL ETCHANT TFB
Standard nickel etchant for evaporated nickel films.
NICKEL ETCHANT TFG
High purity etchant for electrodeposited nickel films. Nickel Etchant TFG is compatible with copper, gallium arsenide, and other III -V compounds.
NICKEL ETCHANT TYPE I
High purity etchant for nickel, nickel-iron alloys, and stainless steel.
FEATURES
Economical
Compatible with positive and negative photoresists
Excellent fine line definition
Uniform etch rates
NICKEL ETCHANTS
DESCRIPTION:
Transene Thin Film Nickel Etchants (Nickel TFB and Nickel TFG) are high-purity nitrate-based formulations for superior etching of evaporated or electroplated nickel films. Nickel Etchants are compatible with both positive and negative photoresist materials. Recommended resists include AZ-111, AZ-1350 OH, and KMER. Nickel Etchants are commonly employed in the manufacture of resistor boards where films of gold, nickel, and nichrome or chromium are to be etched. Nickel Etchant TFG is compatible with copper.
PROPERTIES:
Etchant Type
TFB
TFG
Operating Temperature
25 °C
40 °C
Etch Rate
30 Å/sec
50 Å/sec
Nickel Deposition
Evaporated / sputtered
Electroless / Electroplated
Etch Capacity
270 grams / gal
100 grams/gallon
Typical Film Thickness
1500 Å/ 5-50 micro inches
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Tank
Glass
Glass
APPLICATION:
Nickel Etchants are supplied ready-to-use as immersion type etchants. Etch rates may be controlled via operating temperature. Nickel is normally sandwiched between gold and nichrome or chromium on an alumina substrate. Either evaporative or electroless nickel may be employed. Actual etch is related to film thickness and operating temperature but is typically approximately one minute for evaporative nickel and about four minutes for electroless nickel. Etching should be followed with a deionized water rinse.
Nickel Etchant Type I
Nickel Etchant Type I is a high purity etchant for nickel, nickel-iron alloys, iron, iron oxide, and some types of stainless steel. Copper is also etched by Nickel Etchant Type I. Compatible with a wide range of photoresists (including KPR, Dynachem, AZ, Riston, and Screen Resists). Nickel Etchant Type I contains metal chelating ingredients for optimal performance. Nickel Etchant Type I will not attack gold films.
PROPERTIES:
Operating Temperature
30-60 °C
Tank
Glass
Rinse
Water
Etch Rate- Ni
3 mil/hr @ 40°C
Etch Rate- Ni-Fe
400 Å/sec @ 50°C
Etch Rate- Stainless Steel
(AISI 316 grade)
45 Å/sec @ 25°C
105 Å/sec @ 30°C
Etch Rate- Stainless Steel
(AISI 304 grade)
500 Å/sec @ 45°C
Etch Rate- Fe2O3
50 Å/sec @ 50°C
Etch Rate- Cu
1 mil /min @ 40°C
Agitation
Continuous, mild
APPLICATION:
Nickel Etchant Type I is used at elevated temperatures, typically 30-60°C. Continuous agitation is required for uniform, consistent results. A variety of metal, metal alloy, and metal oxide materials may be etched with Nickel Etchant Type I.
