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Nichrome Etchants TFN

Nichrome Etchant TFN is designed for etching nichrome thin films in microelectronics applications. Nichrome Etchant TFN is compatible with positive and negative photoresists and provide sfine-line control with minimal undercutting. This high purity formulations filtered to 0.2 micron is well suited to critical microelectronic applications.

NICHROME ETHCANT TFN
Minimal undercutting with excellent fine-line control. Consistent operation.

FEATURES:
  • High purity
  • 0.2 micron filtration
  • Compatibility with positive and negative photoresists
  • Fine line control
  • Uniform etch rates
NICHROME ETCHANTS TFN
DESCRIPTION:

Transene Nichrome Etchantd TFN is a high purity system based on ceric ammonium nitrate. Nichrome Etchant TFN provides clean, precise etching of evaporated nichrome layers for the preparation of thin film circuits. High precision photomask etching is also accomplished using Nichrome Etchant TFN. Nichrome Etchant TFN contains semiconductor grade ingredients for ultra-high purity and is filtered to 0.2 microns to remove particulates.

PROPERTIES:

 

TFN

Appearance

Clear orange

Chemistry Base

Ceric Ammonium Nitrate

Specific Gravity

1.127-1.130

Filtration

0.2 microns

Operating Temperature

40 °C

Etch Rate

50 Å /sec @ 40 °C

Etch Capacity

------

Rinse

Deionized water


APPLICATION:

Nichrome Etchant TFN may be operated at room temperature or elevated temperature to increase etch rates. Rinsing with deionized water is suitable. Nichrome Etchant TFN is an improved formulation which etches more cleanly, eliminating the need for an intermediate rinse.