Moly Etchant - TFM
Tungsten Etchant - TFW


Selective etchants for molybdenum and tungsten thin-film metallizations used in semiconductor and microelectronics technology. TFM and TFW selective etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Controlled, uniform etching is achieved by immersion or spray etch technique.

PROPERTIES

 

MOLY ETCH TFM

TUNGSTEN ETCH TFW

Appearance

Amber, aqueous solution

Amber, aqueous solution

pH

10.0

8.0

Dilution

Distilled Water

Distilled Water

Compatible Photoresists

Negative: PKP (Transene)

KMER,KTFR,KPR

Negative & positive

Rinse

Distilled Water

Distilled Water

Flash Point

Non-Flammable

Non-Flammable



 

Mo

W

Etch Rate

--------------------------------

30Å/sec. (immersion)

20 °C

--------------------------------

80Å/sec. (spray)

30 °C

55Å/sec.

140Å/sec.

60 °C

85Å/sec.

250Å/sec.

Etch Capacity

30 grams/gallon

64 grams/gallon

(10,000 in 2/5000Å thick