Kapton Polymide Film Etchant

AN ETCHING REAGENT FORMULATED FOR POLYIMIDE/COPPER LAMINATES, COMPATIBLE WITH PHOTORESIST PROCESSES - RISTON, EASTMAN KODAK, AND DYNACHEM.

ETCH RATE

  

40 °C

0.013 MILS/MINUTE

60 °C

0.07 MILS/MINUTE

RINSE

WATER

STORAGE

ROOM TEMPERATURE

DISPOSAL

DISPOSE OF ACCORDING TO LOCAL, STATE, AND FEDERAL REGULATIONS.