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HEXAMETHYLDISILAZANE- HMDS

PHOTORESIST ADHESION WITH HEXAMETHYLDISILAZANE
Purified hexamethyldisilazane (HMDS) preparations promoting photoresist adhesion on silicon and other substrates.

HMDS - X10

10% HMDS solution in xylene

HMDS - X20

20% HMDS solution in xylene

HMDS - 100%

HMDS concentrate

FEATURES

  • Ready-to-use preparations for surface treatment of silicon
  • Promotes photoresist adhesion on silicon and SiO2 films
  • Prevents lift-off at edges of photoresist and reduces undercutting
  • Ensures full-line resolution
  • Improves yields of MOS and integrated silicon devices

    HMDS- Photoresist Adhesion with Hexamethyldisilazane

    DESCRIPTION:

    HMDS is a purified hexamethyldisilazane with the chemical formula [(CH3)2Si]2NH. The product is used to augment the adhesion of photoresist on silicon and SiO2 surfaces.

    The effectiveness of HMDS on adhesion is correlated with the reactivity of this compound with surface hydroxyl groups to form a new siloxane end product, i.e. Si-O-Si(CH3)3. This newly formed termination on the substrate renders the surface more hydrophobic in character and leads to greater wettability by photoresist. The latter condition is a crucial factor in good bonding. As a result of these altered characteristics due to the surface chemistry, the treated silicon surfaces become highly compatible with both negative and positive photoresists.

    HMDS is offered in usable concentrations diluted with xylene as HMDS-X10 and HMDS-X20. Special blends are supplied upon request.

    PROPERTIES OF HMDS (ACTIVE INGREDIENT)

    PHYSICAL

    Appearance

    Clear, colorless liquid

    Density

    0.77 g/cc

    Index of Refraction

    1.4

    Molecular Weight

    161.4

    Boiling Point

    126-127 °C

    Flash Point

    27 °C
    CHEMICAL

    Typical Purity

    99+%

    Sodium

    < 1 ppm

    Iron

    < 1 ppm

    Lead

    < 1 ppm

    Copper

    < 1 ppm


    APPLICATION:

    HMDS preparations are generally applied to the silicon wafer while spinning, prior to the application of photoresist. As an alternative procedure, the wafers may be immersed in HMDS preparations and allowed to dry after removal.

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