Heat Sinks and Vacuum Oil
Vacoil®
Ultrahigh Vacuum Diffusion Pump Fluid

Produces exceptionally high vacuum of 10-10 torr (mm. Hg) without use of liquid nitrogen - in conventional vacuum systems.

VACOIL-S
General purpose high vacuum applications.

UNIQUE ADVANTAGES
  • Eliminates need for liquid nitrogen refrigeration.
  • Produces ultrahigh vacuum
  • Chemically stable - oxidation resistant
  • Unaffected by exposure to air
  • Rapid pump down - speed up vacuum operations
  • Reduce backstreaming - avoid system contamination
  • Very low fluid consumption - economical
  • Trouble-free operation of vacuum systems
VACOIL® Ultrahigh Vacuum Diffusion Pump Fluid
DESCRIPTION

VACOIL-S is a novel carbon-siloxane compound designed to perform as an ideal diffusion pump fluid in vacuum systems. Its chemical constitution and atomic structure result in very low vapor pressure characteristics, as well as in oxidation-resistant properties. When used as the diffusion pump fluid, VACOIL-S will produce ultrahigh vacuum without need for auxiliary cooling with liquid nitrogen. Conventional water-cooled devices suffice. The product resists oxidation; fouling and formation of tars and carbon do not occur. The inherent heat stability of VACOIL-S allows systems to be opened and exposed to air without decomposition. It is unnecessary to cool diffusion pumps before releasing the vacuum.

PROPERTIES OF VACOIL

Liquid

Clear Water-white liquid

Freezing Point

—16 °C

Boiling Point (0.2 torr)

225 °C

Vapor Pressure (torr @ 20 °C)

1 x 10-10

Heat of Vaporization

(225 °C) 30 Kcal. / mole 22 Kcal. / mole

Back Streaming
a. with trapping
b. without trapping

Nil
(gm/cm2/min) 10-6 gm 10-6 gm


APPLICATIONS

VACOIL products are recommended as replacements for conventional diffusion pump fluids to obtain more efficient, economical, and trouble-free operation of vacuum systems. Exceptionally high vacuums of l0 -10 torr are obtainable. Typical vacuum systems in which VACOIL is applicable include: vacuum evaporators and metallizers; vacuum tube exhaust stations; space simulation chambers; vacuum sputtering; vacuum furnaces; electron beam equipment; thin film microcircuits; optical coatings and specialized instrumentation. The operation and care of these vacuum systems are very much simplified with VACOIL as the diffusion pump fluid. The use of liquid nitrogen is eliminated and the inadvertent exposure to air will not alter the diffusion fluid.

VACOIL products are especially recommended, because of rapid pump down, for vacuum systems which must be opened frequently. VACOIL is particularly useful also in microelectronics vacuum work and thin film device work to eliminate contamination which often results from diffusion oil vapor.

INSTRUCTIONS

VACOIL is used with standard heater input. No change in equipment is needed. The operating temperature is 225 °C to 250 °C. Baffle cooling is obtained in the conventional manner with flowing water; liquid nitrogen need not be used.


XTherm® / XTHERM AG
Heat Sink for Electronic Applications

Thermally conductive heat sink grease applied to the base and mounting stud of transistors, diodes and rectifiers - as a coupling agent - to reduce thermal contact resistance.

Contains alumina in laminar crystallographic orientation, dispersed in a special silcone base material.

FEATURES
  • Excellent heat flow properties-insures proper dissipation of heat.
  • High quality dielectric properties - bulk resistivity 10 ohm-cm and dielectric strength 400 volts per mil.
  • Wide temperature range of operation - -60 °C to 200 °C.
  • Will not dry, harden or bleed.
DESCRIPTION:

XTHERM is a thermally conductive material specially produced to serve as an efficient coupling agent and to reduce thermal contact resistances. Ideal for sputter target applications. XTHERM contains alumina, grown in a laminar form and dispersed in a high temperature, silicone based material. Available as XTherm AG for thermal and electrical conductivity. The special type of alumina used and the silicone material selected enhance the thermal conductance properties of this product, as well as provide high insulation resistance and good dielectric strength.

XTHERM has the consistency of a paste, easily applied between semiconductor power devices and heat sinks, power resistors and chassis mount, thermostats and mounting surfaces. It is likewise applicable to thermoelectric devices and radiators. Properly used, it forms a conductive path between the heat generating circuit element and the heat sink mount. XTHERM thus serves as a heat sink compound in electronic applications where the efficient transfer and removal of heat are necessary. The heat removed is often ten times better with XTHERM than with dry plate mountings.

XTHERM AG is a silver filled, electrically conductive heat sink paste for applications requiring both thermal and electrical conductivity. A high loading of proprietary silver flake provides excellent electrical conductivity properties.

XTHERM and XTHERM AG are ideal for mounting sputter targets where thermal or thermal plus electrical conductivity are needed. XTHERM will not outgas in the sputter chamber and is easily wiped off the back of the target after use.

PHYSICAL PROPERTIES:

Color

Light Gray

Consistency

Paste

Specific Gravity

2.3

Viscosity

1.4 x 106 cps.

Volume Resistivity

1016 ohm-cm

Dielectric Strength

400 volts/mil

Operating Temp. Range

-60 ° to + 200 °C

Thermal Conductivity

1.75 x 10-3 gram cal./cm2/sec./°C/cm

Bleed Characteristics

None (under normal usage)



Tech - Wax®

Superior general purpose wax with high adhesive strength. Thermally stable and chemically resistant - for laboratory and production applications. Semiconductor materials easily mounted for cutting, slicing, dicing or etching.

PROPERTIES:
  • Strong polar bonding for adhesive strength
  • Easily applied and removed
  • Readily soluble in trichloroethylene
  • Will not polymerize from excessive strong acid etching.
  • Economical to use
  • Adaptable to a variety of applications
  • Melts at 90 °C.