Insul-Bond Epoxy Adhesives
Two-Part, Low Temperature Cure, High Peel Strength Systems

Insul-Bond 16 & 17 adhesives are solvent free, electrically non-conductive epoxy systems designed for die attachment, substrate mounting and lid sealing in hybrid microelectronics applications. These 2-part systems feature rapid cure at very low temperatures and outstanding bond "peel" strengths-typically 10 times greater than standard epoxy materials. Application by screen printing (180-225 SS mesh) or automatic dispensing is recommended.

Properties of Insul-Bond Adhesives

 

Epoxy 16

Epoxy 17

Physical (Uncured)

    

Composition

Two-part

Two-part

Color

Tan

Tan

Solids

100%

100%

Viscosity. cps

80,000 cps

80,000 cps

Shelf life

6 months

4 months

Pot life

>2hours

>2 hours

Mixing Ratio by weight A:B

100(A)/7(B)

100(A)/7(B)

Physical (Cured)

    

Bond Strength

    

Sheer

2,000 psi

2,000 psi

Peel

80 pli

80 pli

Heat Distortion Temp.

> 125 °C

> 125 °C

Outgassing (weight loss) 1000 hrs @ 125 °C

0.35%

0.35%

High Temperature Storage:
Peel Strength (125 °C)
Peel Strength (150 °C)

>70 pli
>70 pli

>70 pli
>70 pli

Thermal Conductivity BTU/hr/ft2/in/°F

4

10

Coef. Thermal Expansion in/in/ °C/x 10-6

35

23

Service Temp. Range continuous

-40 °C to 150 °C

-40 °C to +150 °C

Electrical (cured)

    

Volume Resistivity (ohm-cm)

1015 ohm/cm

1015 ohm/cm

Dissipation Factor (1 mc)

.01

.01

Dielectric Constant (1 mc)

3.3

3.3

Dielectric Strength (v/mil)

500 v/mil

500 v/mil


CURE:
Mix in ratio of 100 parts A to 7 parts B (hardener). Select any cure schedule as follows:

50 °C

20 min. (minimum)

20 min. (minimum)

75 °C

15 min. "

15 min. "

100 °C

10 min. "

10 min. "