Insul-Bond Epoxy Adhesives
ONE-PART LOW TEMPERATURE CURING SYSTEMS

Insul-bond Adhesives are solvent-free, low gassing epoxy formulations recommended for discrete component attachment, substrate mounting and lid sealing in the production of high reliability hybrid microcircuits. These adhesives provide multiple bonding of chips or components in a single operation while maintaining low processing temperatures. Subsequent thermal compression or ultrasonic bonding operations are feasible.

Insul-Bond Epoxy 13, 14 and 15 maintain minimal outgassing, high electrical resistivity and high bond strength to 200 °C operating temperatures. Compatibility with aluminum and other metallizations common to microelectronic devices is assured.

Properties of Insul-Bond Adhesives

 

Epoxy 13

Epoxy 14

Epoxy 15

Physical (Uncured)

      

Composition

1-part/filled

1-part/filled

1-part/filled

Color

Buff

Buff

Buff

Solids

100%

100%

100%

Viscosity. cps

Thixotropic paste

Thixotropic paste

Thixotropic paste

Shelf life

6 months

6 months

6 months

Thermal Conductivity BTU/hr/ft2/in/°F

4

12

4

Coef. Thermal Expansion in/in/°C/x 10-6

30

23

30

Outgassing (post cure)

1000 hrs @ 125 °C

0.4%

0.35%

0.4%

Moisture Absorption

7 days immersion 25 °C

0.05%

0.16%

0.05%

Bond Strength

(lap shear @ 25 °C)

125 °C to 1000 HRS

30 Days H20 immersion

2000

1500

2000

1500

1000

1500

2000

1500

------

Service Temp. Range continuous

-40 °C + 150 °C

-40 °C to 150 °C

-40 °C to +150 °C

Electrical (cured)

      

Volume Resistivity(ohm-cm)

1x1015

1x1016

1 x1015

Dissipation Factor (1 mc)

0.01

0.02

0.01

Dielectric Constant(1 mc)

3.9

4.4

3.9

Dielectric Strength(v/mil)

450

450

450


APPLICATION:

Selection of Insul-Bond Epoxy 13, 14 or 15 is made on the basis of thermal conductivity and thermal expansion requirements. Application by screen printing techniques (180-225 mesh screen) or automatic dispensing is suggested. For maximum bond strengths and reproducibility, adhesive thickness of 1 1/2-2 mil is recommended.

CURE SCHEDULE:
FAST-15 min. @ 140 °C; MEDIUM-30 min @ 115 °C; SLOW-1 hr. @ 100 °C