Insul-Bond Epoxy Adhesives ONE-PART LOW TEMPERATURE CURING SYSTEMS
Insul-bond Adhesives are solvent-free, low gassing epoxy formulations recommended for discrete component attachment, substrate mounting and lid sealing in the production of high reliability hybrid microcircuits. These adhesives provide multiple bonding of chips or components in a single operation while maintaining low processing temperatures. Subsequent thermal compression or ultrasonic bonding operations are feasible.
Insul-Bond Epoxy 13, 14 and 15 maintain minimal outgassing, high electrical resistivity and high bond strength to 200 °C operating temperatures. Compatibility with aluminum and other metallizations common to microelectronic devices is assured.
Properties of Insul-Bond Adhesives
Epoxy 13
Epoxy 14
Epoxy 15
Physical (Uncured)
Composition
1-part/filled
1-part/filled
1-part/filled
Color
Buff
Buff
Buff
Solids
100%
100%
100%
Viscosity. cps
Thixotropic paste
Thixotropic paste
Thixotropic paste
Shelf life
6 months
6 months
6 months
Thermal Conductivity BTU/hr/ft2/in/°F
4
12
4
Coef. Thermal Expansion in/in/°C/x 10-6
30
23
30
Outgassing (post cure)
1000 hrs @ 125 °C
0.4%
0.35%
0.4%
Moisture Absorption
7 days immersion 25 °C
0.05%
0.16%
0.05%
Bond Strength
(lap shear @ 25 °C)
125 °C to 1000 HRS
30 Days H20 immersion
2000
1500
2000
1500
1000
1500
2000
1500
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Service Temp. Range continuous
-40 °C + 150 °C
-40 °C to 150 °C
-40 °C to +150 °C
Electrical (cured)
Volume Resistivity(ohm-cm)
1x1015
1x1016
1 x1015
Dissipation Factor (1 mc)
0.01
0.02
0.01
Dielectric Constant(1 mc)
3.9
4.4
3.9
Dielectric Strength(v/mil)
450
450
450
APPLICATION:
Selection of Insul-Bond Epoxy 13, 14 or 15 is made on the basis of thermal conductivity and thermal expansion requirements. Application by screen printing techniques (180-225 mesh screen) or automatic dispensing is suggested. For maximum bond strengths and reproducibility, adhesive thickness of 1 1/2-2 mil is recommended.
CURE SCHEDULE:
FAST-15 min. @ 140 °C; MEDIUM-30 min @ 115 °C; SLOW-1 hr. @ 100 °C