Transene - Encapsulants

General Purpose Epoxies
For Electronic Potting Applications

Newest epoxy materials for potting semiconductor components and electronic assemblies.

EPOXY – 125
Room temperature curing epoxy – for applications to 125 °C.

EPOXY – 175
Elevated temperature curing epoxy – for applications to 175 °C.

EPOXY – 200
Novalac-epoxy formulation – for applications to 200 °C.

Epoxy – 225
Resin-anhydride epoxy system – for high temperature applications to 225 °C.

GENERAL PURPOSE EPOXIES
Description:

General purpose epoxies are formulated as two component systems to provide the best electrical, physical and mechanical properties attainable. The epoxy systems comprise (1) a resin, based upon etho-xylene polymer chemistry, and (2) a reactive hardener to increase linear polymerization and cross-linking of the epoxy. Resin systems are relatively low in viscosity and contain low-loss filler for improved physical characteristics. Castings, which are shrink free, void free and low in thermal expansion, are easily prepared. The electrical characteristics are not sacrificed.

Applications
General purpose epoxies are recommended for protection and low cost packing of semiconductor components, electronic devices and circuit assemblies. The epoxy compounds meet AIEE classes A-B-C-D-H for electrical potting compounds, as well as MIL specifications.

PROPERTIES OF GENERAL PURPOSE EPOXIES

Physical Properties	Epoxy –125	Epoxy –175	Epoxy –200	Epoxy –225
Color	Black	Black	Black	Black
Heat Dist.temp. (°C)	125	175	200	225
Visc. Mixed (cps)	2,200	38,000	20,000	4,200
Flex. Str. (psi)	13,600	15,600	14,500	14,000
Flex.Mod.x 10^-5(psi)	4.08	3.37	3.90	4.4
Comp.Yield Str. (psi)	15,000	15,820	35,000	18,500
Comp.Mod x 10^-5(psi)	3.40	3.10	2.60	2.89
Tensile Str. (psi)	11,300	10,500	10,000	10,000
Tens.Mod x 10^-5(psi)	¾	¾	4.3	4.4
Izod Imp. Str.(ft.lbs./in.notch)	0.3	0.33	0.50	0.48
Hardness, Shore D	85	90	90	90
Shrinkage (max.)	1%	1%	1%	1%
Thermal Expan.(in/in/°C)x 10^-6	30	30	30	30

Electrical Properties
Dielectric Constant
Frequency, cps 60	4.10	4.18	3.93	3.09
Frequency, cps 10³	3.99	4.12	3.88	3.07
Frequency, cps 10⁶	3.39	3.57	3.47	2.91
Dissipation Factor
Frequency, cps 60	0.0099	0.005	0.0067	0.0035
Frequency, cps 10³	0.023	0.015	0.015	0.0054
Frequency, cps 10⁶	0.034	0.039	0.029	0.015
Volume Resist.	1.19 x 10¹⁶	1.2 x 10¹⁶	1.2 x 10¹⁶	5.8 10¹⁶
Surface Resist.	7.9 x 10¹⁵	7.8 x 10¹⁵	7.9 x 10¹⁵	7.9 x 10¹⁵
Dielect. Str. V/mil	420	455	585	390
Arc Resit. (Av.Sec.)	¾	¾	120	75
Cure Schedule
Resin: Hardener Ratio	100:17	100:12	100:10	100:45
Pot Life	1 hr.	4 hrs.	4 hrs.	>24Hrs.
Initial Gel	4 hrs @ RT	2 hrs @ 90 °C.	2 hrs @ 80 °C.	2 hrs @ 90 °C.
Post-Cure	+48 hrs @ RT	+4 hrs @ 150 °C.	+2 hrs @ 150 °C.	+4 hrs @ 165 °C +16hrs@ 200°C

Epoxy Based Potting Compound XS-531

Epoxy Based Potting Compound XS-531 is a high quality product formulated for potting electronic assemblies. It is designed for military applications and complies with military specifications, (XS-531 Department of Navy, Bureau of Naval Weapons).

PROPERTIES:

System	2-part
Filler	Silica
Viscosity (mixed)	2,000 pcs (approx.)
Hardness	70-90 (shore D)
Insulation Resistance, as cast	10⁶ megohms (min)
Insulation Res., after humidity	10³ megohms (min)
Bond Strength	1000 (min) psi

MIXING RATIO:
75 Part A to 25 Part B. Deaeration recommended.

CURE:
65 °-95 °C, 3-4 hours minimum

Epotherm
Thermally Conductive Epoxy Compounds

High thermal conductive epoxy compounds for potting semiconductor compounds for semiconductor components and electronic assemblies.

Epotherm – 130
Room temperature curing epoxy with high thermal conductivity and excellent electrical insulation properties – for applications up to 130 °C.

Epotherm – 180
Elevated temperature curing epoxy with high thermal conductivity and excellent electrical insulation – for applications up to 180 °C.

EPOTHERM
DESCRIPTION

Epotherm epoxies, thermally conductive compounds, are specially formulated for the encapsulation and potting of electronic components and assemblies used at high temperatures. These potting compounds are highly filled systems containing aluminum oxide in laminar crystallographic form to achieve high thermal conductivity. Temperature-stable epoxy resins designed for these applications are also used in the formulation. Due to the excellent heat transfer characteristics of Epotherm, the dissipation of heat generated by the potted electronic components is assured.

Epotherm epoxies are supplied as two component systems, curable at room and elevated temperatures. In addition to high thermal conductivity, there is good adhesion, extremely low coefficient of expansion, and low shrinkage upon curing. High electrical insulation is not sacrificed.

APPLICATION:

Epotherm products should be used for low cost packaging of semiconductors, electronic components and assemblies when thermal considerations dictate the selection of potting materials with good heat transfer properties.

Properties of Epotherm Epoxy Compounds

Physical Properties Epotherm-130 Epotherm - 180

Color	Black	Black
Thermal Cond. Coef. BTU-ft/ft²-hr-°F	12	12
Coef. Of Therm. Expans. In/in/°C	20x10^-6	18x10^-6
Heat Distortion Temp °C	130	180
Viscosity (mixed) (cps)	40M	100M
Flexural Strength (psi)	13,000	13,500
Flexural Modulus (psi)	2x10^-6	2x10^-6
Compressive Yield Strength psi	14,200	14,500
Tensile Strength (psi)	9,000	8,500
Izod Impact Strength lb/in notch	0.30	0.25
Hardness – Shore D	95	95
Machinability	By grinding	By grinding
Electrical Properties
Dielect. Const. (av. 10^-2 to 10¹⁰ cps)	4.0	4.5
Dissipation Factor
Frequency 60 cps	0.01	0.008
Frequency 10⁵ cps	0.02	0.01
Volume Resistivity	8.9x10¹⁵	5x10¹⁶
Surface Resistivity	7.2x10¹⁵	8.5x10¹⁵
Dielect. Strength volts/mil	420	450
Arc.Resistance sec.	--	100
Cure Schedule
Resin: Hardener	100:5.5	100:4.5
Pot Life	1 hr.	6 hrs.
Cure	4 hrs. @ RT or mild heat	2 hrs. @ 70 °C.
Post-Cure	48 hrs @ RT	4 hrs @ 150 °C