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Printed Circuit Copper Etchants

Ferric chloride solutions for etching copper, copper alloy and Kovar in printed circuit board applications. Ammonium Persulfate Etchant for Thin Film applications.

PC COPPER ETCHANT -100
For immersion etching

PC COPPER ETCHANT -200
For spray etching techniques

APS-100 COPPER ETCHANT
For thin film and PC circuits

FEATURES
  • Ready - to - use
  • Highly compatible with widely used photoresists
  • Etches copper with straight sides
  • Easily processed
PRINTED CIRCUIT COPPER ETCHANTS
DESCRIPTION


Transene Printed Circuit Copper Etchants (CE-100 and CE-200) are ferric chloride solutions formulated with proprietary wetting antifoam plus chelating additives to optimize etching performance. Ferric chloride solutions are the most widely used etchants for copper, copper alloys and Kovar in printed circuit board applications. The etchants are highly compatible with commonly used photoresists (KPR, DYNACHEM, AZ, RISTON, SCREEN RESISTS, etc.) These etchants should not be used when solder-plated resists are employed.
APS-100 Copper Etchant is formulated for controlled etching providing fine line definition suitable for thin film circuits. Additionally, compatibility with tin-lead solders is assured.

PC COPPER ETCHANTS

 

CE-100

CE-200

APS-100

Etchant type

Immersion

Immersion/Spray

Immersion/Spray

 

Dip or Spray

   

Operating Temperature

40-60 C

40-60 C

30-40 C

Etch Rate
@ 40 C


1 mil/min


.5 mil/min.


80/sec.

Time to etch 1oz. copper

1 1/2 min.

3 minutes

7 1/2 min.

Etch capacity

19 oz. Cu/gal.

14 oz Cu/gal.

10 oz Cu/gal.


APPLICATION:

Copper Immersion Etchant (CE-100) is supplied ready-to-use. Recommended operating temperature is 40-60 C. Many users discard spent etchant at 50% solution exhaustion (i.e. after etching 8-10 oz. Cu metal/gal.) and replace with fresh etchant.
After etching 8 oz. Cu metal/gal. etch rates may become longer than desired. Addition of 500 ml HCl (37%) per gallon of etchant will effectively increase etch rate and allow use of etchant to 70% solution exhaustion (14 oz. Cu metal/gal.) Agitation of work in the etchant bath is advisable and will increase etch rates and improve definition.

Copper Spray Etchant (CE-200) is supplied ready-to-use. The recommended operating temperature is
40-60 C. Its use is recommended for spray etching techniques and will provide precision etching at controlled rates. Spent etchant should be discarded and replaced with fresh etchant when etch rates become longer than desired. (i.e. 7-8 oz. Cu metal/gal.)
After etching with either CE-100 or CE-200, rinse work with heavy water spray followed by a rinse with 5 - 10% HCl (or oxalic acid) then final water spray.

ETCHING TANK AND EQUIPMENT - DISPOSAL OF SPENT ETCHANT
Use PVC, glass, or epoxy-coated tanks. Heaters may be quartz, carbon or titanium (nickel or cobalt-steel may also be used). Neutralize spent CE-100/200 with calcium carbonate and dilute with water. Sewer disposal is not recommended.

Selective Copper Etchants

Copper Etchant 49-1 Copper Etchant 49-1 White Paper
Copper Etchant BTP


DESCRIPTION:

Transene Copper Etchant 49-1 is a high purity, controllable etchant for specific microelectronic etch applications such as gallium arsenide or copper. Copper Etchant 49-1 is fully compatible with solders used in new lead free technology such as 100% tin and tin 97%-silver 3% as well as gold, nickel, and nickel-vanadium alloys. Copper Etch BTP provides a faster etch rate while maintaining nickel compatibility.

PROPERTY

Copper Etchant 49-1

Copper Etchant BTP

Appearance

Clear, colorless liquid

Deep Purple

pH

5.9-6.3

>9.0

Storage Temp.

40-60 F

50-80 F

Shelf Life

6 months

1 year

Etch Rate

22 /sec @ 30 C

150 /sec @ 30 C

Etch Temperature

30-40 C

30-40 C

Resist Compatibility

Positive or Negative

Negative

Capacity

90-100 wafers/gallon

100-120 wafers/gallon



APPLICATION:

Selective Copper Etchants are best used at slightly elevated temperatures. Avoid temperatures above 60 C. Continuous mild agitation is required.

Selective Copper Etchants are manufactured using high purity raw materials such as semi or ACS Reagent chemicals and 10-18 Mohm.cm resistivity deionized water. The pH of both solutions is maintained using ammonium hydroxide.