SEARCH PRODUCTS

Etchants for chromium thin films for microelectronics applications offer excellent compatibility with positive and negative photoresists. Chromium Etchants provide fine-line control with minimal undercutting. High purity formulations filtered to 0.2 micron are ideal for critical devices.

CHROMIUM ETCHANT 1020
Fast etch rate with minimal undercutting

CHROMIUM ETCHANT 1020AC
Slower etch rate to eliminate undercutting and for broader compatibility

CHROMIUM MASK ETCHANT CE-5M
Ideal for high precision photomask etching.

CHROMIUM CERMET ETCHANT TFE
For chromium-silicon films. Compatible with copper, nickel, and gold.

FEATURES:
  • High purity
  • 0.2 micron filtration
  • Excellent photoresist compatibility
  • Uniform etch rates and patterns.


Chromium Etchants
1020 and 1020AC


DESCRIPTION:

Transene Chromium Etchants 1020 and 1020AC are high purity ceric ammonium nitrate systems for precise, clean etching of chromium and chromium oxide films. Chromium Etchant 1020AC is nitric-acid free and exhibits a slower etch rate. Both etchants are compatible with positive and negative photoresists. Chromium Etchant 1020 is filtered to remove all particulates above 0.2 microns. Minimal undercutting is achieved with Chromium Etchant 1020AC.

PROPERTIES:

 

1020

1020AC

Appearance

Clear, orange

Clear, orange

Specific Gravity

1.127-1.130

1.127-1.130

Filtration

0.2 micron

-----

Operating Temperature

Variable

Variable

Etch Rate, 40 C

40 / sec

32 / sec

Storage

Room Temperature

Room Temperature

Rinse

Deionized Water

Deionized Water



APPLICATION:

Etching temperature varies depending on film thickness. Etch times range from 15 seconds to 60 seconds at room temperature. Chromium Etchants should be operated in a well ventilated hood.

 

 


Chromium Cermet Etchant TFE


DESCRIPTION:

Chromium Cermet Etchant TFE is a selective chromium etchant for microelectronics applications. Chromium Cermet Etchant TFE effectively etches chromium films deposited on copper, nickel, or gold. This potassium hexacyanoferrate formulation is compatible with only negative photoresist. In addition, TFE is an excellent choice for etching chromium oxide, Cr-Si, and Cr-Si-O deposits.

PROPERTIES:

Appearance

Amber

Etch Rate, 50 C

15-20 / sec

Operating Temperature

40-60 C

Rinse

Deionized Water

Storage

Room Temperature

Photoresist

Negative

Compatible Metals

Gold, Copper, Nickel



APPLICATION:

Chromium Cermet Etchant TFE is a ready-to-use solution specifically designed to remove films of Cr, Cr-O, Cr-Si, and Cr-Si-O from metal substrates such as copper, gold, and nickel. Heating the etchant to 40-60 oC will speed the etch rate for thicker films. Continuous stirring is recommended during etching.




Chromium Etchants
For Use in Thin Film Microelectronics.

These etchants are designed for minimal undercutting and good process control. They are compatible with negative and positive photoresists.

Chromium - Types 8001-N and 8002-A
For slower etch rate
8001-N: Nitric acid based
8002-A: Acetic acid based

Chromium Cermet Etch - Type TFE
Standard Cr-Si and Cr-SiO Cermets
Etch Rate: 1000 /min (for 20 atomic % SiO)


CHROMIUM ETCHANT CRE-473

Chromium Etchant CRE-473 is a selective chromium etchant for plated hard chromium in microelectronics applications. CRE-473 effectively etches plated chromium films deposited on copper, nickel, gold, or molybdenum. Good compatibility with positive and negative photoresists is obtained.  CRE-473 is not an effective etchant for sputtered, evaporated, or bulk chromium.

Properties

Appearance

Water white

Etch Rate @ 25 °C

14 Å / sec

Operating Temperature

25-40 °C

Rinse

Deionized Water

Storage

Room Temperature

APPLICATIONS:

Chromium Etchant CRE-473 is a ready-to-use solution specifically designed to remove electroplated chromium films from metal substrates such as copper, gold, nickel, and molybdenum. Heating the etchant to 40 °C will speed the etch rate for thicker films.