Transene - Etchants

Etchants for chromium thin films for microelectronics applications offer excellent compatibility with positive and negative photoresists. Chromium Etchants provide fine-line control with minimal undercutting. High purity formulations filtered to 0.2 micron are ideal for critical devices.

CHROMIUM ETCHANT 1020
Fast etch rate with minimal undercutting

CHROMIUM ETCHANT 1020AC
Slower etch rate to eliminate undercutting and for broader compatibility

CHROMIUM MASK ETCHANT
Ideal for high precision photomask etching.

CHROMIUM CERMET ETCHANT TFE
For chromium-silicon films. Compatible with copper, nickel, and gold.

FEATURES:

High purity
0.2 micron filtration
Excellent photoresist compatibility
Uniform etch rates and patterns.

Chromium Etchants
1020 and 1020AC

DESCRIPTION:

Transene Chromium Etchants 1020 and 1020AC are high purity ceric ammonium nitrate systems for precise, clean etching of chromium and chromium oxide films. Chromium Etchant 1020AC is nitric-acid free and exhibits a slower etch rate. Both etchants are compatible with positive and negative photoresists. Chromium Etchant 1020 is filtered to remove all particulates above 0.2 microns. Minimal undercutting is achieved with Chromium Etchant 1020AC.

PROPERTIES:

	1020	1020AC
Appearance	Clear, orange	Clear, orange
Specific Gravity	1.127-1.130	1.127-1.130
Filtration	0.2 micron	-----
Operating Temperature	Variable	Variable
Etch Rate, 40 °C	40 Å / sec	32 Å / sec
Storage	Room Temperature	Room Temperature
Rinse	Deionized Water	Deionized Water

APPLICATION:

Etching temperature varies depending on film thickness. Etch times range from 15 seconds to 60 seconds at room temperature. Chromium Etchants should be operated in a well ventilated hood.

Chromium Cermet Etchant TFE

DESCRIPTION:

Chromium Cermet Etchant TFE is a selective chromium etchant for microelectronics applications. Chromium Cermet Etchant TFE effectively etches chromium films deposited on copper, nickel, or gold. This potassium hexacyanoferrate formulation is compatible with only negative photoresist. In addition, TFE is an excellent choice for etching chromium oxide, Cr-Si, and Cr-Si-O deposits.

PROPERTIES:

Appearance	Amber
Etch Rate, 50 °C	15-20 Å / sec
Operating Temperature	40-60 °C
Rinse	Deionized Water
Storage	Room Temperature
Photoresist	Negative
Compatible Metals	Gold, Copper, Nickel

APPLICATION:

Chromium Cermet Etchant TFE is a ready-to-use solution specifically designed to remove films of Cr, Cr-O, Cr-Si, and Cr-Si-O from metal substrates such as copper, gold, and nickel. Heating the etchant to 40-60 oC will speed the etch rate for thicker films. Continuous stirring is recommended during etching.

Chromium Etchants
For Use in Thin Film Microelectronics.

These etchants are designed for minimal undercutting and good process control. They are compatible with negative and positive photoresists.

Chromium - Types 8001-N and 8002-A
For slower etch rate
8001-N: Nitric acid based
8002-A: Acetic acid based

Chromium Cermet Etch - Type TFE
Standard Cr-Si and Cr-SiO Cermets
Etch Rate: 1000 Å/min (for 20 atomic % SiO)

CHROMIUM ETCHANT CRE-473

Chromium Etchant CRE-473 is a selective chromium etchant for plated hard chromium in microelectronics applications. CRE-473 effectively etches plated chromium films deposited on copper, nickel, gold, or molybdenum. Good compatibility with positive and negative photoresists is obtained. CRE-473 is not an effective etchant for sputtered, evaporated, or bulk chromium.

Properties

Appearance	Water white
Etch Rate @ 25 °C	14 Å / sec
Operating Temperature	25-40 °C
Rinse	Deionized Water
Storage	Room Temperature

APPLICATIONS:

Chromium Etchant CRE-473 is a ready-to-use solution specifically designed to remove electroplated chromium films from metal substrates such as copper, gold, nickel, and molybdenum. Heating the etchant to 40 °C will speed the etch rate for thicker films.