Etchants for chromium thin films for microelectronics applications offer excellent compatibility with positive and negative photoresists. Chromium Etchants provide fine-line control with minimal undercutting. High purity formulations filtered to 0.2 micron are ideal for critical devices.

CHROMIUM ETCHANT 1020
Fast etch rate with minimal undercutting

CHROMIUM ETCHANT 1020AC
Slower etch rate to eliminate undercutting and for broader compatibility

CHROMIUM MASK ETCHANT
Ideal for high precision photomask etching.

CHROMIUM CERMET ETCHANT TFE
For chromium-silicon films. Compatible with copper, nickel, and gold.

FEATURES:
  • High purity
  • 0.2 micron filtration
  • Excellent photoresist compatibility
  • Uniform etch rates and patterns.


Chromium Etchants
1020 and 1020AC

DESCRIPTION:

Transene Chromium Etchants 1020 and 1020AC are high purity ceric ammonium nitrate systems for precise, clean etching of chromium and chromium oxide films. Chromium Etchant 1020AC is nitric-acid free and exhibits a slower etch rate. Both etchants are compatible with positive and negative photoresists. Chromium Etchant 1020 is filtered to remove all particulates above 0.2 microns. Minimal undercutting is achieved with Chromium Etchant 1020AC.

PROPERTIES:

 

1020

1020AC

Appearance

Clear, orange

Clear, orange

Specific Gravity

1.127-1.130

1.127-1.130

Filtration

0.2 micron

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Operating Temperature

Variable

Variable

Etch Rate, 40 °C

40 Å / sec

32 Å / sec

Storage

Room Temperature

Room Temperature

Rinse

Deionized Water

Deionized Water



APPLICATION:

Etching temperature varies depending on film thickness. Etch times range from 15 seconds to 60 seconds at room temperature. Chromium Etchants should be operated in a well ventilated hood.

 

 


Chromium Cermet Etchant TFE

DESCRIPTION:

Chromium Cermet Etchant TFE is a selective chromium etchant for microelectronics applications. Chromium Cermet Etchant TFE effectively etches chromium films deposited on copper, nickel, or gold. This potassium hexacyanoferrate formulation is compatible with only negative photoresist. In addition, TFE is an excellent choice for etching chromium oxide, Cr-Si, and Cr-Si-O deposits.

PROPERTIES:

Appearance

Amber

Etch Rate, 50 °C

15-20 Å / sec

Operating Temperature

40-60 °C

Rinse

Deionized Water

Storage

Room Temperature

Photoresist

Negative

Compatible Metals

Gold, Copper, Nickel


APPLICATION:

Chromium Cermet Etchant TFE is a ready-to-use solution specifically designed to remove films of Cr, Cr-O, Cr-Si, and Cr-Si-O from metal substrates such as copper, gold, and nickel. Heating the etchant to 40-60 oC will speed the etch rate for thicker films. Continuous stirring is recommended during etching.




Chromium Mask Etchant
For High Precision Metal Photomasks

An improved chromium etchant used in the new technology for fabricating high quality chrome photomasks. Removes chromium chromium-clad glass plates to form masking patterns in microelectronic applications.

FEATURES

  • Excellent resist compatibility
  • Room temperature operated
  • Visual etching control
  • Definition in submicron range
  • Economical
CHROMIUM MASK ETCHANT
DESCRIPTION:

Transene Chromium Mask Etchant is a product designed for the critical etch process in the new technique for making chrome metal photomasks. Chrome masks are economical to produce and, as used in microelectronics, give much better service than emulsion type photomasks.

Chromium Mask Etchant permits precise etching of chromium. It is relatively non-toxic and non-hazardous to use, replacing conventional dangerous laboratory etchants in the mask making process. The etchant is room-temperature operated, offers excellent visual etch control and is compatible with both positive and negative photoresist materials. Fine line definition and geometrics are registered and held to tolerances in the sub-micron range.

Transene Chromium Mask Etchant is used successfully on all Kodak chromium-clad plates or chromium-on-glass plates in general.

Properties of Chromium Mask Etchants

Etch rate

800 Å/min at 25 °C
 

2400 Å/min at 40 °C

Etch capacity

30 mgs chromium/ml etchant

Operating Temp

25 °C

Miscibility

Water

Storage

Room Temp.

Shelf Life

Unlimited


APPLICATIONS

Recommended photoresist materials, highly compatible with Chromium Mask Etchant, including all positive and negative photoresists. These afford reproductions of micro-images in chromium. The etchant can be used directly on Kodak MetalClad Plate P which incorporates a positive-working photosensitive resist coating on chromium-coating glass.

Operating procedures should be followed as described in the instructions. In general the etch process involves the following operations:
  1. Application of photoresist
  2. Pre-bake
  3. Exposure of photoresist to U.V.
  4. Develop photoresist
  5. Post-bake
  6. Etch chromium
The thickness of chromium clad on plates is on the order of 800 Å. The etching time is therefore on the order of 60 seconds.


Chromium and Nichrome Etchants
For Use in Thin Film Microelectronics.

These etchants are designed for minimal undercutting and good process control. They are compatible with negative and positive photoresists.

Chromium Etchant - Type TFD
Standard Chromium Etchant
Etch: 20 Å/Sec. @ 25°C

Chromium - Types 8001-N and 8002-A
For slower etch rate
8001-N: Nitric acid based
8002-A: Acetic acid based

Chromium Cermet Etch - Type TFE
Standard Cr-Si and Cr-SiO Cermets
Etch Rate: 1000 Å/min (for 20 atomic % SiO)