Copper Plating Acid Type

DESCRIPTION:

Transene Copper Plating Acid Type is ideal for high-speed copper deposition including through hole plating. The bath exhibits good stability and is easily controlled. Stabilizer limit resistivity and promote a bright deposit.

PROPERTIES

Temperature (°F)

70-120

Current Density (A/ft2)

20-50

Anode

Copper

Anode to cathode ratio

1:1

Agitation

Mechanical

Voltage (V)

4-6

Filtration

Continuous

Tank

Glass, fiberglass, pvc, ceramic, rubber

pH

2.5 - 3.5

pH control

Sulfuric Acid

Deposition rate @ 20 asf

0.5 mil/hour

Copper concentration (oz/gal)

6


APPLICATIONS:

Copper Plating Acid Type is used to plate copper of any thickness onto ferrous base metals over copper strike. Especially suited for plating through holes and over trenches where over plating is a concern. The bright deposit consists of uniformly distributed rather than columnar grains. Copper Plating Acid Type is also advantageous as a protective coating under nichrome.